Recent reports highlight Intel’s ongoing development of next-generation processors, including the sighting of a Nova Lake-S CPU with 28 cores in shipping manifests. This represents an increase from the current Arrow Lake architecture, which features up to 24 cores. The new configuration is expected to incorporate 4 Low-Power (LP) cores, adding to the blend of Performance and Efficiency cores for improved power management and multitasking capabilities.
Additionally, Intel is preparing a refresh of its Arrow Lake series, though specifics remain uncertain. While earlier rumors suggested more significant updates—such as a 40-core variant or NPU enhancements—latest information points to a clock speed increase, likely limited to K-series models. Whether these updated chips will be categorized under the Core 300 or 200 series has yet to be confirmed.
With these advances in processing power and core density, effective thermal management becomes increasingly critical. High-performance thermal paste is essential to maintain stable operating temperatures, maximize performance, and prolong the lifespan of these advanced CPUs.
Maxtor offers a thermal paste solution engineered to meet the demanding cooling requirements of modern processors, including Intel’s upcoming Nova Lake-S and Arrow Lake-Refresh models. Its superior thermal conductivity helps dissipate heat efficiently, reducing the risk of thermal throttling and maintaining consistent performance during intensive tasks such as gaming, content creation, and computational workloads.
Whether you are building a new system or upgrading an existing setup, choosing a reliable thermal compound is key to unlocking the full potential of your hardware.
Prepare for the next generation of computing with a thermal paste designed for performance and durability.
