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How to Use a Phase Change Thermal Pad for Better Heat Dissipation

How to Use a Phase Change Thermal Pad for Better Heat Dissipation

Learn how to correctly apply the XTP-001 phase change thermal pad between heat-generating components and heat sinks to reduce thermal resistance and improve cooling performance.
2026-06-29
Maxtor AP-306 Thermal Putty: High Conductivity Gap Filler for Electronics Cooling

Maxtor AP-306 Thermal Putty: High Conductivity Gap Filler for Electronics Cooling

Maxtor AP-306 is a non-curing 11.5W/mK thermal putty for GPU, VRAM, power modules, telecom equipment, and automotive electronics. It fills uneven gaps between components and heatsinks to improve heat transfer, electrical insulation, and long-term cooling
2026-06-27
Thermal Paste for Miner Cooling Applications

Thermal Paste for Miner Cooling Applications

8301C Thermal Paste 12 W/mK high thermal conductivity thermal compound for ASIC miner GPU mining rig CPU cooling stable heat dissipation for 24/7 mining operation.
2026-05-13
Congratulations to success in GuangZhou lighting exhibition

Congratulations to success in GuangZhou lighting exhibition

include all coming exhibitons
2019-06-21
Welcome to Computex TaiPei

Welcome to Computex TaiPei

Welcome to Computex Taipei
2024-06-12
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